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      Philips Semiconductors Product specification Damper diode BY459X-1500, BY459X-1500S fast, high-voltage MECHANICAL DATA Dimensions in mm Net Mass: 2 g Fig.8. SOD113; The seating plane is electrically isolated from all terminals. Notes 1. Refer to mounting instructions for F-pack envelopes. 2. Epoxy meets UL94 V0 at 1/8". REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC EIAJ SOD113 2-lead TO-220 0 10 20 mm scale Plastic single-ended package; isolated heatsink mounted; 1 mounting hole; 2-leads TO-220 'full pack' SOD113 w M 12 b E P e A A1 b1 c Q k j q D T HE L L (1) 1 m z Notes 1. Terminals are uncontrolled within zone L1. 2. z is depth of T. UNITA A1bb1 c DEeHE jk zL (1) 1 (2) max. L mPQqTw DIMENSIONS (mm are the original dimensions) mm 0.8 0.4 4.6 4.0 2.9 2.5 1.1 0.9 0.9 0.7 0.7 0.4 15.8 15.2 10.3 9.7 5.08 19.0 14.4 13.5 3.3 2.8 6.5 6.3 2.6 2.3 2.6 2.55 2.7 2.3 0.6 0.4 3.2 3.0 97-06-11 November 2002 5 Rev 2.000 |